Cooling electronic equipment and its parts and components presents system designers and hardware developers with ever increasing challenges. Because not only is power throughput continually rising, but packing density, too, is increasing, allowing systems less and less space for cooling and heat dissipation.
It is therefore important to incorporate electronics cooling into the overall plan at an early stage in the design process.
Cooling from component to system level
This begins with the simulation of the thermal behavior of individual components such as processors, chips, LEDs or IGBTs. Depending on output, design and the materials used, heat generation can vary here, too, and can play a vital role in the placement of components within the device.
6SigmaET imports all the details of your individual components from your CAD data and combines them with the available datasheet values and a comprehensive material library. Components can be modeled accurately thanks to intelligent parametric specification, allowing for a realistic simulation of the heat generated.
This gives you the basis for an efficient thermal design – realistic and reliable.
Cooling entire systems
Interaction between individual components, their configuration within the equipment and additional features such as housing material obviously also play a key role here. This also applies to the type of usage: because whereas stationary electronic equipment is usually exposed to only slight temperature fluctuations, devices such as smartphones etc. are sometimes left to lie in the direct sunlight and can thus overheat more easily.
When simulating complete systems, 6SigmaET also relies on your CAD data. The individual elements can be assigned different parameters, which results in a realistic model.
In this way it is possible for 6SigmaET to produce simulations with detailed electronic equipment in a realistic environment with up to 700 million cells in acceptable computation times.
An overview of the options
With 6SigmaET you get an easy-to-operate but reliable simulation tool for equipment-level cooling and thermal management.
Simple user interface
Access to MCAD and ECAD data such as STEP, Gerber, ODB++ and more
Comprehensive libraries for materials, fans and ECXML component access
Optimum integration – highly automated
Fast, stable solver (Windows, Linux, cluster-enabled)
Numerical and graphical results analysis, automated reporting and the ability to export data to be processed in Excel.
Ball joint of the Schunk company.
Detailed simulation of PCB heat losses (transmission losses & component outputs) and mechanical losses (brakes, motor)
Detailed CFD heat simulation of a concert amplifier with forced cooling and power components
Simulated cooling design for a heatpipe-based cooling unit including detailed electronics.
Simulation of indoor and outdoor LED lighting systems in realistic installation conditions
Thermal simulation of a mobile phone docking station